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TTTC's Electronic Broadcasting Service |
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IEEE International Workshop on Testing Three-Dimensional Stacked Integrated Circuits
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CALL FOR PAPERS
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The 3D-TEST Workshop focuses exclusively on test of and design-for-test for three-dimensional stacked ICs (3D-SICs), including Systems-in-Package (SiP), Package-on-Package (PoP), and especially 3D-SICs based on Through-Silicon Vias (TSVs), micro-bumps, and/or interposers. While 3D-SICs offer many attractive advantages with respect to heterogeneous integration, smaller form-factor, higher bandwidth and performance, and lower power dissipation, there are many open issues with respect to testing such products. The 3D-TEST Workshop offers a forum to present and discuss these challenges and (emerging) solutions among researchers and practitioners alike. 3D-TEST will take place in conjunction with the IEEE International Test Conference (ITC) and is sponsored by the Test Technology Technical Council (TTTC) of IEEE Computer Society. Topic Areas – You are invited to participate and submit your contributions to the 3D-TEST Workshop. The workshop’s areas of interest include (but are not limited to) the following topics:
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Submission Instructions – Submissions must be sent in PDF. The Workshop prefers Full Paper submissions (of up to six pages), but also allows Extended Abstract submissions (of at least two pages). Detailed submission instructions can be found at the Workshop’s website: http://3dtest.tttc-events.org. All submissions will be evaluated for selection with respect to their suitability for the workshop, originality, technical soundness, and presented results. Selected submissions can be accepted for regular or poster presentation at the Workshop. Publications – The workshop will make available to all participants an Electronic Workshop Digest, which includes all material that authors are willing to provide in PDF: abstract, paper, slides, poster, background material, etc. |
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| Additional Information | |
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General Chair: Yervant Zorian Program Chair: Erik Jan Marinissen Program Vice-Chair: Shi-Yu Huang |
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| Committee | |
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General Chair: Program Chair / Vice Chair: Finance Chair: Panel Chair: Publication Chair: Publicity Chair: Web Chair: Arrangements Chair: Program Committee Members: |
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| For more information, visit us on the web at: http://3dtest.tttc-events.org |
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The CONFERENCE is sponsored by the Institute of Electrical and Electronics Engineers (IEEE) Computer Society's Test Technology Technical Council (TTTC). |
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IEEE
Computer Society- Test Technology Technical Council |
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TTTC CHAIR
PAST CHAIR
TTTC 1ST VICE CHAIR
SECRETARY
ITC GENERAL CHAIR TEST WEEK COORDINATOR TUTORIALS AND EDUCATION STANDARDS EUROPE MIDDLE EAST & AFRICA STANDING COMMITTEES ELECTRONIC MEDIA |
PRESIDENT OF BOARD SENIOR PAST CHAIR TTTC 2ND VICE CHAIR FINANCE IEEE DESIGN & TEST EIC TECHNICAL MEETINGS TECHNICAL ACTIVITIES ASIA & PACIFIC LATIN AMERICA NORTH AMERICA COMMUNICATIONS INDUSTRY ADVISORY BOARD |
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